Merge branch 'drm-next' of ../main_line/linux-drm into dave-drm-next
[deliverable/linux.git] / drivers / usb / dwc3 / Makefile
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1ccflags-$(CONFIG_USB_DWC3_DEBUG) := -DDEBUG
2ccflags-$(CONFIG_USB_DWC3_VERBOSE) += -DVERBOSE_DEBUG
3
4obj-$(CONFIG_USB_DWC3) += dwc3.o
5
6dwc3-y := core.o
d07e8819 7dwc3-y += host.o
67920bd7 8dwc3-y += gadget.o ep0.o
d07e8819 9
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10ifneq ($(CONFIG_DEBUG_FS),)
11 dwc3-y += debugfs.o
12endif
13
14##
15# Platform-specific glue layers go here
16#
17# NOTICE: Make sure your glue layer doesn't depend on anything
18# which is arch-specific and that it compiles on all situations.
19#
20# We want to keep this requirement in order to be able to compile
21# the entire driver (with all its glue layers) on several architectures
22# and make sure it compiles fine. This will also help with allmodconfig
23# and allyesconfig builds.
24#
25# The only exception is the PCI glue layer, but that's only because
26# PCI doesn't provide nops if CONFIG_PCI isn't enabled.
27##
28
29obj-$(CONFIG_USB_DWC3) += dwc3-omap.o
30
d28a9689
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31##
32# REVISIT Samsung Exynos platform needs the clk API which isn't
33# defined on all architectures. If we allow dwc3-exynos.c compile
34# always we will fail the linking phase on those architectures
35# which don't provide clk api implementation and that's unnaceptable.
36#
37# When Samsung's platform start supporting pm_runtime, this check
38# for HAVE_CLK should be removed.
39##
40ifneq ($(CONFIG_HAVE_CLK),)
41 obj-$(CONFIG_USB_DWC3) += dwc3-exynos.o
42endif
43
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44ifneq ($(CONFIG_PCI),)
45 obj-$(CONFIG_USB_DWC3) += dwc3-pci.o
46endif
47
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