drivers/thermal/Kconfig

   1 #
   2 # Generic thermal sysfs drivers configuration
   3 #
   4
   5 menuconfig THERMAL
   6         tristate "Generic Thermal sysfs driver"
   7         help
   8           Generic Thermal Sysfs driver offers a generic mechanism for
   9           thermal management. Usually it's made up of one or more thermal
  10           zone and cooling device.
  11           Each thermal zone contains its own temperature, trip points,
  12           cooling devices.
  13           All platforms with ACPI thermal support can use this driver.
  14           If you want this support, you should say Y or M here.
  15
  16 if THERMAL
  17
  18 config THERMAL_HWMON
  19         bool
  20         prompt "Expose thermal sensors as hwmon device"
  21         depends on HWMON=y || HWMON=THERMAL
  22         default y
  23         help
  24           In case a sensor is registered with the thermal
  25           framework, this option will also register it
  26           as a hwmon. The sensor will then have the common
  27           hwmon sysfs interface.
  28
  29           Say 'Y' here if you want all thermal sensors to
  30           have hwmon sysfs interface too.
  31
  32 config THERMAL_OF
  33         bool
  34         prompt "APIs to parse thermal data out of device tree"
  35         depends on OF
  36         default y
  37         help
  38           This options provides helpers to add the support to
  39           read and parse thermal data definitions out of the
  40           device tree blob.
  41
  42           Say 'Y' here if you need to build thermal infrastructure
  43           based on device tree.
  44
  45 config THERMAL_WRITABLE_TRIPS
  46         bool "Enable writable trip points"
  47         help
  48           This option allows the system integrator to choose whether
  49           trip temperatures can be changed from userspace. The
  50           writable trips need to be specified when setting up the
  51           thermal zone but the choice here takes precedence.
  52
  53           Say 'Y' here if you would like to allow userspace tools to
  54           change trip temperatures.
  55
  56 choice
  57         prompt "Default Thermal governor"
  58         default THERMAL_DEFAULT_GOV_STEP_WISE
  59         help
  60           This option sets which thermal governor shall be loaded at
  61           startup. If in doubt, select 'step_wise'.
  62
  63 config THERMAL_DEFAULT_GOV_STEP_WISE
  64         bool "step_wise"
  65         select THERMAL_GOV_STEP_WISE
  66         help
  67           Use the step_wise governor as default. This throttles the
  68           devices one step at a time.
  69
  70 config THERMAL_DEFAULT_GOV_FAIR_SHARE
  71         bool "fair_share"
  72         select THERMAL_GOV_FAIR_SHARE
  73         help
  74           Use the fair_share governor as default. This throttles the
  75           devices based on their 'contribution' to a zone. The
  76           contribution should be provided through platform data.
  77
  78 config THERMAL_DEFAULT_GOV_USER_SPACE
  79         bool "user_space"
  80         select THERMAL_GOV_USER_SPACE
  81         help
  82           Select this if you want to let the user space manage the
  83           platform thermals.
  84
  85 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
  86         bool "power_allocator"
  87         select THERMAL_GOV_POWER_ALLOCATOR
  88         help
  89           Select this if you want to control temperature based on
  90           system and device power allocation. This governor can only
  91           operate on cooling devices that implement the power API.
  92
  93 endchoice
  94
  95 config THERMAL_GOV_FAIR_SHARE
  96         bool "Fair-share thermal governor"
  97         help
  98           Enable this to manage platform thermals using fair-share governor.
  99
 100 config THERMAL_GOV_STEP_WISE
 101         bool "Step_wise thermal governor"
 102         help
 103           Enable this to manage platform thermals using a simple linear
 104           governor.
 105
 106 config THERMAL_GOV_BANG_BANG
 107         bool "Bang Bang thermal governor"
 108         default n
 109         help
 110           Enable this to manage platform thermals using bang bang governor.
 111
 112           Say 'Y' here if you want to use two point temperature regulation
 113           used for fans without throttling.  Some fan drivers depend on this
 114           governor to be enabled (e.g. acerhdf).
 115
 116 config THERMAL_GOV_USER_SPACE
 117         bool "User_space thermal governor"
 118         help
 119           Enable this to let the user space manage the platform thermals.
 120
 121 config THERMAL_GOV_POWER_ALLOCATOR
 122         bool "Power allocator thermal governor"
 123         help
 124           Enable this to manage platform thermals by dynamically
 125           allocating and limiting power to devices.
 126
 127 config CPU_THERMAL
 128         bool "generic cpu cooling support"
 129         depends on CPU_FREQ
 130         depends on THERMAL_OF
 131         help
 132           This implements the generic cpu cooling mechanism through frequency
 133           reduction. An ACPI version of this already exists
 134           (drivers/acpi/processor_thermal.c).
 135           This will be useful for platforms using the generic thermal interface
 136           and not the ACPI interface.
 137
 138           If you want this support, you should say Y here.
 139
 140 config CLOCK_THERMAL
 141         bool "Generic clock cooling support"
 142         depends on COMMON_CLK
 143         depends on PM_OPP
 144         help
 145           This entry implements the generic clock cooling mechanism through
 146           frequency clipping. Typically used to cool off co-processors. The
 147           device that is configured to use this cooling mechanism will be
 148           controlled to reduce clock frequency whenever temperature is high.
 149
 150 config DEVFREQ_THERMAL
 151         bool "Generic device cooling support"
 152         depends on PM_DEVFREQ
 153         depends on PM_OPP
 154         help
 155           This implements the generic devfreq cooling mechanism through
 156           frequency reduction for devices using devfreq.
 157
 158           This will throttle the device by limiting the maximum allowed DVFS
 159           frequency corresponding to the cooling level.
 160
 161           In order to use the power extensions of the cooling device,
 162           devfreq should use the simple_ondemand governor.
 163
 164           If you want this support, you should say Y here.
 165
 166 config THERMAL_EMULATION
 167         bool "Thermal emulation mode support"
 168         help
 169           Enable this option to make a emul_temp sysfs node in thermal zone
 170           directory to support temperature emulation. With emulation sysfs node,
 171           user can manually input temperature and test the different trip
 172           threshold behaviour for simulation purpose.
 173
 174           WARNING: Be careful while enabling this option on production systems,
 175           because userland can easily disable the thermal policy by simply
 176           flooding this sysfs node with low temperature values.
 177
 178 config HISI_THERMAL
 179         tristate "Hisilicon thermal driver"
 180         depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST
 181         depends on HAS_IOMEM
 182         help
 183           Enable this to plug hisilicon's thermal sensor driver into the Linux
 184           thermal framework. cpufreq is used as the cooling device to throttle
 185           CPUs when the passive trip is crossed.
 186
 187 config IMX_THERMAL
 188         tristate "Temperature sensor driver for Freescale i.MX SoCs"
 189         depends on CPU_THERMAL
 190         depends on MFD_SYSCON
 191         depends on OF
 192         help
 193           Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
 194           It supports one critical trip point and one passive trip point.  The
 195           cpufreq is used as the cooling device to throttle CPUs when the
 196           passive trip is crossed.
 197
 198 config SPEAR_THERMAL
 199         tristate "SPEAr thermal sensor driver"
 200         depends on PLAT_SPEAR || COMPILE_TEST
 201         depends on HAS_IOMEM
 202         depends on OF
 203         help
 204           Enable this to plug the SPEAr thermal sensor driver into the Linux
 205           thermal framework.
 206
 207 config ROCKCHIP_THERMAL
 208         tristate "Rockchip thermal driver"
 209         depends on ARCH_ROCKCHIP || COMPILE_TEST
 210         depends on RESET_CONTROLLER
 211         depends on HAS_IOMEM
 212         help
 213           Rockchip thermal driver provides support for Temperature sensor
 214           ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
 215           trip point. Cpufreq is used as the cooling device and will throttle
 216           CPUs when the Temperature crosses the passive trip point.
 217
 218 config RCAR_THERMAL
 219         tristate "Renesas R-Car thermal driver"
 220         depends on ARCH_RENESAS || COMPILE_TEST
 221         depends on HAS_IOMEM
 222         help
 223           Enable this to plug the R-Car thermal sensor driver into the Linux
 224           thermal framework.
 225
 226 config KIRKWOOD_THERMAL
 227         tristate "Temperature sensor on Marvell Kirkwood SoCs"
 228         depends on MACH_KIRKWOOD || COMPILE_TEST
 229         depends on HAS_IOMEM
 230         depends on OF
 231         help
 232           Support for the Kirkwood thermal sensor driver into the Linux thermal
 233           framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
 234
 235 config DOVE_THERMAL
 236         tristate "Temperature sensor on Marvell Dove SoCs"
 237         depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
 238         depends on HAS_IOMEM
 239         depends on OF
 240         help
 241           Support for the Dove thermal sensor driver in the Linux thermal
 242           framework.
 243
 244 config DB8500_THERMAL
 245         tristate "DB8500 thermal management"
 246         depends on MFD_DB8500_PRCMU
 247         default y
 248         help
 249           Adds DB8500 thermal management implementation according to the thermal
 250           management framework. A thermal zone with several trip points will be
 251           created. Cooling devices can be bound to the trip points to cool this
 252           thermal zone if trip points reached.
 253
 254 config ARMADA_THERMAL
 255         tristate "Armada 370/XP thermal management"
 256         depends on ARCH_MVEBU || COMPILE_TEST
 257         depends on HAS_IOMEM
 258         depends on OF
 259         help
 260           Enable this option if you want to have support for thermal management
 261           controller present in Armada 370 and Armada XP SoC.
 262
 263 config TEGRA_SOCTHERM
 264         tristate "Tegra SOCTHERM thermal management"
 265         depends on ARCH_TEGRA
 266         help
 267           Enable this option for integrated thermal management support on NVIDIA
 268           Tegra124 systems-on-chip. The driver supports four thermal zones
 269           (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
 270           zones to manage temperatures. This option is also required for the
 271           emergency thermal reset (thermtrip) feature to function.
 272
 273 config DB8500_CPUFREQ_COOLING
 274         tristate "DB8500 cpufreq cooling"
 275         depends on ARCH_U8500 || COMPILE_TEST
 276         depends on HAS_IOMEM
 277         depends on CPU_THERMAL
 278         default y
 279         help
 280           Adds DB8500 cpufreq cooling devices, and these cooling devices can be
 281           bound to thermal zone trip points. When a trip point reached, the
 282           bound cpufreq cooling device turns active to set CPU frequency low to
 283           cool down the CPU.
 284
 285 config INTEL_POWERCLAMP
 286         tristate "Intel PowerClamp idle injection driver"
 287         depends on THERMAL
 288         depends on X86
 289         depends on CPU_SUP_INTEL
 290         help
 291           Enable this to enable Intel PowerClamp idle injection driver. This
 292           enforce idle time which results in more package C-state residency. The
 293           user interface is exposed via generic thermal framework.
 294
 295 config X86_PKG_TEMP_THERMAL
 296         tristate "X86 package temperature thermal driver"
 297         depends on X86_THERMAL_VECTOR
 298         select THERMAL_GOV_USER_SPACE
 299         select THERMAL_WRITABLE_TRIPS
 300         default m
 301         help
 302           Enable this to register CPU digital sensor for package temperature as
 303           thermal zone. Each package will have its own thermal zone. There are
 304           two trip points which can be set by user to get notifications via thermal
 305           notification methods.
 306
 307 config INTEL_SOC_DTS_IOSF_CORE
 308         tristate
 309         depends on X86
 310         select IOSF_MBI
 311         help
 312           This is becoming a common feature for Intel SoCs to expose the additional
 313           digital temperature sensors (DTSs) using side band interface (IOSF). This
 314           implements the common set of helper functions to register, get temperature
 315           and get/set thresholds on DTSs.
 316
 317 config INTEL_SOC_DTS_THERMAL
 318         tristate "Intel SoCs DTS thermal driver"
 319         depends on X86
 320         select INTEL_SOC_DTS_IOSF_CORE
 321         select THERMAL_WRITABLE_TRIPS
 322         help
 323           Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
 324           temperature sensor (DTS). These SoCs have two additional DTSs in
 325           addition to DTSs on CPU cores. Each DTS will be registered as a
 326           thermal zone. There are two trip points. One of the trip point can
 327           be set by user mode programs to get notifications via Linux thermal
 328           notification methods.The other trip is a critical trip point, which
 329           was set by the driver based on the TJ MAX temperature.
 330
 331 config INTEL_QUARK_DTS_THERMAL
 332         tristate "Intel Quark DTS thermal driver"
 333         depends on X86_INTEL_QUARK
 334         help
 335           Enable this to register Intel Quark SoC (e.g. X1000) platform digital
 336           temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
 337           The DTS will be registered as a thermal zone. There are two trip points:
 338           hot & critical. The critical trip point default value is set by
 339           underlying BIOS/Firmware.
 340
 341 config INT340X_THERMAL
 342         tristate "ACPI INT340X thermal drivers"
 343         depends on X86 && ACPI
 344         select THERMAL_GOV_USER_SPACE
 345         select ACPI_THERMAL_REL
 346         select ACPI_FAN
 347         select INTEL_SOC_DTS_IOSF_CORE
 348         select THERMAL_WRITABLE_TRIPS
 349         help
 350           Newer laptops and tablets that use ACPI may have thermal sensors and
 351           other devices with thermal control capabilities outside the core
 352           CPU/SOC, for thermal safety reasons.
 353           They are exposed for the OS to use via the INT3400 ACPI device object
 354           as the master, and INT3401~INT340B ACPI device objects as the slaves.
 355           Enable this to expose the temperature information and cooling ability
 356           from these objects to userspace via the normal thermal framework.
 357           This means that a wide range of applications and GUI widgets can show
 358           the information to the user or use this information for making
 359           decisions. For example, the Intel Thermal Daemon can use this
 360           information to allow the user to select his laptop to run without
 361           turning on the fans.
 362
 363 config ACPI_THERMAL_REL
 364         tristate
 365         depends on ACPI
 366
 367 config INTEL_PCH_THERMAL
 368         tristate "Intel PCH Thermal Reporting Driver"
 369         depends on X86 && PCI
 370         help
 371           Enable this to support thermal reporting on certain intel PCHs.
 372           Thermal reporting device will provide temperature reading,
 373           programmable trip points and other information.
 374
 375 config MTK_THERMAL
 376         tristate "Temperature sensor driver for mediatek SoCs"
 377         depends on ARCH_MEDIATEK || COMPILE_TEST
 378         depends on HAS_IOMEM
 379         default y
 380         help
 381           Enable this option if you want to have support for thermal management
 382           controller present in Mediatek SoCs
 383
 384 menu "Texas Instruments thermal drivers"
 385 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
 386 depends on HAS_IOMEM
 387 source "drivers/thermal/ti-soc-thermal/Kconfig"
 388 endmenu
 389
 390 menu "Samsung thermal drivers"
 391 depends on ARCH_EXYNOS || COMPILE_TEST
 392 source "drivers/thermal/samsung/Kconfig"
 393 endmenu
 394
 395 menu "STMicroelectronics thermal drivers"
 396 depends on ARCH_STI && OF
 397 source "drivers/thermal/st/Kconfig"
 398 endmenu
 399
 400 config QCOM_SPMI_TEMP_ALARM
 401         tristate "Qualcomm SPMI PMIC Temperature Alarm"
 402         depends on OF && SPMI && IIO
 403         select REGMAP_SPMI
 404         help
 405           This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
 406           PMIC devices. It shows up in sysfs as a thermal sensor with multiple
 407           trip points. The temperature reported by the thermal sensor reflects the
 408           real time die temperature if an ADC is present or an estimate of the
 409           temperature based upon the over temperature stage value.
 410
 411 endif