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ARM: dts: omap3: Add support for IGEP COM Module
authorJavier Martinez Canillas <javier.martinez@collabora.co.uk>
Wed, 19 Dec 2012 13:33:10 +0000 (14:33 +0100)
committerBenoit Cousson <benoit.cousson@linaro.org>
Mon, 8 Apr 2013 22:16:46 +0000 (00:16 +0200)
commit9ad1df2b15b0f1952a57c3407996450cc64bc976
treebcc48932c08c39014df328c1e822f158b8f85a62tree | snapshot
parentcb5e191e96953965aab8aa3bf4c0aee01faaaf79commit | diff
ARM: dts: omap3: Add support for IGEP COM Module

ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.

This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.

Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
arch/arm/boot/dts/Makefile diff | blob | blame | history
arch/arm/boot/dts/omap3-igep0030.dts [new file with mode: 0644] blob
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